Research

Packaging for Microelectronics

The emerging area of very low-cost, disposable microelectronic systems such as RFID tags, smart cards, microsensor systems, etc. is the hottest research topic for me at the moment. I am currently working on developing packaging solutions for entirely printable, ultra-low cost, flex systems. This includes direct-write material deposition methods and laser processing of deposited materials.

Projects
Publications
Patents
Others

Machining Theory

 Machining has been my priority research area for a long time. The hybrid analytical-FEM solution of the orthogonal metal cutting process that I have recently developed could serve as a kernel of a cutting model to predict some of the most important process parameters such as the cutting forces, temperature fields, and tool wear. Theoretical considerations and experimental evidence indicate that the orthogonal model could be expanded to the more general three-dimensional case. By adding the models of the cutting tool and work, a fully predictive virtual machining operation could be then developed to predict the dimensional errors in machining caused by the tool elastic deformations, temperature deformations, and cutting tool wear.

Publications
Others

Tribology

 My interests here are mostly in tribology of machining but I'm also working in the characterization and evaluation of thin-film tribological coatings.

Projects
Publications
Others

Back | Home