Development work conducted at the NDSU Center for Nanoscale Science and Engineering was presented recently at the IMAPS Device Packaging conference in Phoenix.
Topics and authors included:
- “Sapphire Surface Protection During Sapphire Micromachining and Through-Sapphire Via Formation for Device Densification, Backside Interconnect and Chip Stacking,” Fred Haring and Kevin Mattson, fabrication technicians; Greg Strommen, engineering technician; Syed Sajid Ahmad, manager of engineering services; and Aaron Reinholz, assistant director for electronics technology.
- “Development of Passives on Sapphire Backside,” Cherish Bauer-Reich, research engineer; Mike Reich, senior research engineering; Layne Berge, graduate student; Haring; Oliver Boeckel, mechanical engineering major; Mattson; Strommen; Justin Vignes, student; Ahmad and Reinholz.
- “Through-Sapphire Via Filling Process Development for Backside Interconnect and Chip Stacking and Front-to-Back Interconnect Demonstration With a Front-to-Back Daisy Chain Chip,” Ahmad, Haring, Mattson, Strommen, Vignes and Reinholz.
- “A Comparison of Through-Sapphire Via Process Development at Laser Services Suppliers,” Ahmad; Haring; Nathan Schneck, student; Strommen; Sydney Boschert, student; Minara Sooriarchi, Kacie Gerstner, Vignes and Reinholz.
Ahmad also presented a professional development course, “Basics of Conventional and Advanced Chip Packaging.”
NDSU is recognized as one of the nation's top 108 public and private universities by the Carnegie Commission on Higher Education.