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CNSE researchers present at international microelectronics symposium

Published: 10 December 2009
created by Sadie Anderson

Fred Haring, fabrication technician, and Bernd Scholz, engineer, at NDSU’s Center for Nanoscale Science and Engineering (CNSE) presented a poster presentation and paper at the 2009 International Microelectronics and Packaging Society 42nd International Symposium on Microelectronics, held Nov. 1-5, in San Jose, Calif.

Titled “A Process to Produce Low Cost Solder Balls in Custom Sizes,” the presentation was based on research being developed at CNSE. “The ability to produce solder balls with standard surface mount technology equipment in custom sizes for use on electronic components, chip scale packages, or even on silicon wafers, allows manufacturers and R&D facilities to save money by not having to buy large quantities of solder balls, and gives them the ability to make custom sizes for specific chip needs,” said Haring. “This solder ball production process also fits the niche of producing small quantities of custom alloy solder balls as they are being designed and tested in R&D settings prior to real world applications.” The paper was co-written by Jacob Baer, Syed Sajid Ahmad and Aaron Reinholz. 

In addition, Scholz’s presented his paper “Novel Multi-Chip Packaging Method Using Stochastic Self Assembly,” was presented to 500 symposium participants. The paper, co-written by Sourin Bhattacharya, discussed research being conducted at CNSE in the area of advanced microelectronics packaging process. “Packaging” refers to the full enclosure and electrical interconnection from a small silicon chip to a part, which can be implemented into a portable electronic device like a hearing aid or cell phone.

The International Microelectronics and Packaging Society conference promotes international cooperation, understanding and promotion of efforts and disciplines in microelectronics packaging and design, 3D packaging, thermal management, lead free issues, micro electro-mechanical systems packaging, reliability testing, bio-med and advanced electronics materials and technologies. The society promotes international, national, state and student chapters.

NDSU is in the process of starting a student chapter. For information, contact Haring at 1-5336.


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Last Updated: Wednesday, April 16, 2014 10:25:31 AM