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Lande Named Interim Director of NDSU's Center for Nanoscale Science and Engineering

Mark Lande has been named interim director of the Center for Nanoscale Science and Engineering (CNSE) at North Dakota State University. The appointment, effective December 1, 2011, was announced by Philip Boudjouk, vice president for research, creative activities & technology transfer at NDSU.

Fargo, N.D. –– Mark Lande has been named interim director of the Center for Nanoscale Science and Engineering (CNSE) at North Dakota State University. The appointment, effective December 1, 2011, was announced by Philip Boudjouk, vice president for research, creative activities & technology transfer at NDSU.

Lande is a certified public accountant with experience in municipal government, public accounting, residential real estate development and experience as a controller for public broadcasting. He joined the NDSU Center for Nanoscale Science and Engineering in 2004 as finance specialist and was named assistant director for administrative and financial services in 2006. Lande’s role includes financial management of CNSE research programs, financial reporting, accounting and projections, and operational compliance standards.

“The main duties of the interim director will be the administration of CNSE’s finances and the restructuring of CNSE to enhance its potential to attract private sector funding,” said Dr. Philip Boudjouk, vice president for research.  “The technical focal points of CNSE will focus on microelectronics and combinatorial science and technology.  The term of the position is expected to be at least six months,” said Boudjouk.

NDSU’s Center for Nanoscale Science and Engineering, Fargo, conducts multidisciplinary research with partners in government, industry, private and university sectors. CNSE’s scientific capabilities include flexible electronics and materials, electronics miniaturization, wireless sensors, RFID, bioactive materials, combinatorial science, and coatings technologies. Research conducted at CNSE has been featured in the Journal of Bioadhesion and Biofilm, Journal of Combinatorial Chemistry, New Electronics, Innovations Report, IEEE Transactions on Advanced Packaging, Chip Scale Review, Wired magazine, the Financial Times and other scientific and business publications and conference proceedings.  www.ndsu.edu/cnse


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