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NDSU Device Packaging Laboratory

 

Shibaura High/Low Force Die Bonder (T41 & T42)
Precisely positions and attaches chips to substrates or packages. Allows use of die attach pastes or films.

Picture of Shibaura High/Low Force Die Bonder

Tresky T-3200 Semi-Automated Die Bonder (T56)

Places many types and sizes of die on various size substrates.
Picture of Tresky T-3200 Semi-Automated Die Bonder

K&S 8028 Wire Bonder (T44)

Ultrasonically welds very thin gold wire (25 micron) to make electrical connections.
Picture of K&S 8028 Wire Bonder

West Bond Manual Wire Bonder (T55)

Ultrasonically welds very thin aluminum or gold wire to make electrical connection.
Picture of West Bond Manual Wire Bonder

 

 

Milara Screen Printer (T45)

Precisely prints solders, adhesives, and polymers through stencil or screen to join or protect electronic assemblies.
Picture of Milara Screen Printer

Camalot Dispenser (T34)

Dispenses adhesives and pastes (conductive or non-conductive) in precise patterns to join or protect delicate devices or assemblies.
Picture of Camalot Dispenser

DEK Stencil Printer (T49)
Prints solder pastes, adhesives and polymers through a stencil or screen onto a printed circuit board or substrate.

Picture of DEK Stencil Printer

 

 

ADT Dicing Saw (T36)

Saws (cuts) wafers into individual chips or cuts substrates into individual packages.
Picture of ADT Dicing Saw

UV Film Release/ UV Curing System (part of T36)

Releases substrates and wafers from carrier films. Provides UV exposure.
Picture of UV Film Release/ UV Curing System

SEC Wafer Frame Mount/Film Frame Tape Applicator (part of T36)

Applies tape to carrier frames to protect and carry wafers and substrates.
Picture of SEC Wafer Frame Mount/Film Frame Tape Applicator

MYDATA Pick & Place (T48)

Assembly machine picks and places electronic devices as small as 0.020” x 0.010” to as large as 2” x 2” onto circuit boards prior to reflow.
Picture of MYDATA Pick & Place

Ball Grid Array Solder Ball Placement System (T40)

Places solder balls at predefined locations on electronic components (CSP/BGAs) and assemblies.
Picture of Ball Grid Array Solder Ball Placement System

Electrovert Reflow Oven (T47)

Programmable oven melts (reflows) solder paste that has been printed on a circuit board.
Picture of Electrovert Reflow Oven

Hanmi Molding Press (T35)

Molds thermoset plastics over components or assemblies for their protection and packaging.
Picture of Hanmi Molding Press and Pellet Preheater

OPTEK Laminator (T33)

Laminates material layers together under heat and pressure.
Picture of OPTEK Laminator

Trumpf Laser Marker (T37)
Uses laser to mark chips, components and assemblies for identification and tracking. It can also inscribe and cut certain materials.

Picture of Trumpf Laser Marker

LPKF Prototype Milling Machine (T29)

In-house circuit board prototyping.
Picture of LPKF Prototype Milling Machine

 

 

Trio Tech Autoclave (T53)
Cures materials under high pressure and temperature.

Picture of Trio Tech Autoclave

Austin America Aqueous Cleaner (T46)
Aqueous washer that is used to wash by-products and contamination from assembled electronic components and assemblies.

Picture of Austin America Aqueous Cleaner

March Plasma Cleaner (T31)

Uses oxygen or argon plasma to clean surfaces of circuit boards, substrates, chips and carriers.
Picture of March Plasma Cleaner

ESPEC Convection Ovens (T32)
Programmable oven used to cure or age materials and assemblies in air or Nitrogen gas atmosphere.

Picture of ESPEC Convection Ovens

ESPEC Vacuum Oven (T32)
Vacuum oven utilizes a vacuum chamber for eliminating air pockets and/or air bubbles as they are being cured.

Picture of ESPEC Vacuum Oven

 

 

Buehler Micro-hardness Tester (T51)
Measures hardness of very small surface areas of materials for characterization, study and comparison.

Picture of Buehler Micro-hardness Tester

Dage Wire Pull/Ball Shear Tester (T50)
Measures the mechanical adhesion strength of wire bonds,  lead interconnects, and die attach.

Picture of Dage Wire Pull/Ball Shear Tester

OGP Measuring System (T39)
Optically measures x, y and z dimensions of objects to 1 micron accuracy.

Picture of OGP Measuring System

Centipede/Checksum Circuit Tester (T38)
Performs electrical testing of packaged components and circuitry.

Picture of Centipede/Checksum Circuit Tester

Microscopes (T23)

Numerous microscopes are available for inspection including the following models:  Leica DM ILM, Leica S6D, National 407TBL, Olympus BH2-MJL, and Sony TL-10M.
Picture of Microscope

 

 

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RCA
Phone: 701.231.8045
Physical/delivery address:  1735 NDSU Research Park Drive/Fargo, ND 58102
Mailing address:  P.O. Box 6050—Dept. 4000/Fargo, ND 58108-6050
Page manager: RCA

Last Updated: Tuesday, July 05, 2016 1:21:05 PM
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