Device Packaging Laboratory
Wire and Die Bonders
| T41 | High Force Die Bonder | ||
| T56 | Tresky Semi-Automated Die Bonder | ||
| T44 | K&S 8028 Wire Bonder | ||
| T55 | Westbond Manual Wire Bonder |
Printing / Dispensing Equipment
| T45 | Milara Screen Printer | ||
| T34 | Camelot Dispenser | ||
| T49 | DEK Stencil Printer |
Packaging and Assembly Equipment
| T36 | ADT Wafer Dicing Saw | ||
| T48 | MyData Pick & Place | ||
| T47 | Electrovert Reflow Oven | ||
| T35 | Hanmi Mold Press | ||
| T33 | Optec Laminator | ||
| T29 | LPKF Circuit Board Milling Machine |
Process Support Equipment
| T53 | TrioTech Autoclave | ||
| T46 | Austin America Aqueous Cleaner | ||
| T31 | March Plasma Cleaner | ||
| T32 | CSP Ovens: ESPEC Convection Oven, ESPEC Vacuum Oven, |
Test and Inspection Equipment
| T51 | Microhardness Tester | ||
| T50 | Dage Pull/Shear tester | ||
| T39 | OGP Measuring System (Smartscope) | ||
| T38 | Checksum Circuit Tester |